EPF6024AQC208-1N
vs
EPF6024ABC256-3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
FQFP,
|
BGA, BGA256(UNSPEC)
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
CAN ALSO BE USED 24000 LOGIC GATES
|
CAN ALSO BE USED 24000 LOGIC GATES
|
Clock Frequency-Max |
172 MHz
|
133 MHz
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
JESD-609 Code |
e3
|
e0
|
Length |
28 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
171
|
218
|
Number of Inputs |
171
|
218
|
Number of Outputs |
171
|
218
|
Number of Terminals |
208
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
4 DEDICATED INPUTS, 171 I/O
|
4 DEDICATED INPUTS, 218 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
2.3 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
27 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
ECCN Code |
|
3A991.D
|
Samacsys Manufacturer |
|
Intel
|
Number of Logic Cells |
|
1960
|
Package Equivalence Code |
|
BGA256(UNSPEC)
|
Peak Reflow Temperature (Cel) |
|
220
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare EPF6024AQC208-1N with alternatives
Compare EPF6024ABC256-3 with alternatives