EPF6024AQC208-1N vs EPF6024ABC256-3 feature comparison

EPF6024AQC208-1N Intel Corporation

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EPF6024ABC256-3 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description FQFP, BGA, BGA256(UNSPEC)
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE USED 24000 LOGIC GATES CAN ALSO BE USED 24000 LOGIC GATES
Clock Frequency-Max 172 MHz 133 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e0
Length 28 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 171 218
Number of Inputs 171 218
Number of Outputs 171 218
Number of Terminals 208 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 171 I/O 4 DEDICATED INPUTS, 218 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.3 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 28 mm 27 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 256
ECCN Code 3A991.D
Samacsys Manufacturer Intel
Number of Logic Cells 1960
Package Equivalence Code BGA256(UNSPEC)
Peak Reflow Temperature (Cel) 220
Technology CMOS
Time@Peak Reflow Temperature-Max (s) 20

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