EPF6024ABC256-3 vs EPF6024ABI256-1 feature comparison

EPF6024ABC256-3 Altera Corporation

Buy Now Datasheet

EPF6024ABI256-1 Altera Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description BGA, BGA256(UNSPEC) BGA, BGA256(UNSPEC)
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature CAN ALSO BE USED 24000 LOGIC GATES ALSO CONFIGURABLE WITH 5V VCC
Clock Frequency-Max 133 MHz 172 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 218 218
Number of Inputs 218 218
Number of Logic Cells 1960 1960
Number of Outputs 218 218
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 218 I/O 4 DEDICATED INPUTS, 218 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256(UNSPEC) BGA256(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.3 mm 2.3 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 27 mm 27 mm
Base Number Matches 2 1

Compare EPF6024ABC256-3 with alternatives

Compare EPF6024ABI256-1 with alternatives