EPF10K30AFC256-1
vs
EPF10K30ABI256-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA, BGA256,16X16,40
BGA, BGA256,16X16,40
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
11.5
11.5
Average Weight (mg)
914.1
914.1
CO2e (mg)
10512.15
10512.15
Category CO2 Kg
11.5
11.5
Compliance Temperature Grade
Commercial: +0C to +70C
Industrial: -40C to +85C
Candidate List Date
2015-06-15
2016-06-20
Additional Feature
1728 LOGIC ELEMENTS; 216 LABS
Clock Frequency-Max
80 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
27 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
191
191
Number of Inputs
246
246
Number of Logic Cells
1728
1728
Number of Outputs
246
246
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4 DEDICATED INPUTS, 191 I/O
4 DEDICATED INPUTS, 191 I/O
Output Function
REGISTERED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.3 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
27 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
256
Peak Reflow Temperature (Cel)
220
Compare EPF10K30AFC256-1 with alternatives
Compare EPF10K30ABI256-3 with alternatives