EPF10K30ABI256-3
vs
EPF10K30RC208-3N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
QFP
Package Description
BGA, BGA256,16X16,40
RQFP-208
Pin Count
256
208
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e1
e3
Length
27 mm
28 mm
Number of Dedicated Inputs
4
4
Number of I/O Lines
191
147
Number of Inputs
246
147
Number of Logic Cells
1728
1728
Number of Outputs
246
147
Number of Terminals
256
208
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4 DEDICATED INPUTS, 191 I/O
4 DEDICATED INPUTS, 147 I/O
Output Function
MIXED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HFQFP
Package Equivalence Code
BGA256,16X16,40
HQFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel)
220
245
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
2 ns
0.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.3 mm
4.1 mm
Supply Voltage-Max
3.6 V
5.25 V
Supply Voltage-Min
3 V
4.75 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
27 mm
28 mm
Base Number Matches
1
2
Pbfree Code
Additional Feature
1728 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
66.67 MHz
Moisture Sensitivity Level
3
Time@Peak Reflow Temperature-Max (s)
30
Compare EPF10K30ABI256-3 with alternatives
Compare EPF10K30RC208-3N with alternatives