EPF10K30RC208-3N
vs
EPF10K30ABC256-3
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
QFP
BGA
Package Description
RQFP-208
BGA, BGA256,16X16,40
Pin Count
208
256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1728 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
66.67 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e3
e1
Length
28 mm
27 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
147
191
Number of Inputs
147
246
Number of Logic Cells
1728
1728
Number of Outputs
147
246
Number of Terminals
208
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 147 I/O
4 DEDICATED INPUTS, 191 I/O
Output Function
REGISTERED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HFQFP
BGA
Package Equivalence Code
HQFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
245
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.6 ns
2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
2.3 mm
Supply Voltage-Max
5.25 V
3.6 V
Supply Voltage-Min
4.75 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
28 mm
27 mm
Base Number Matches
2
1
Compare EPF10K30RC208-3N with alternatives
Compare EPF10K30ABC256-3 with alternatives