EPF10K100EFI256-2N
vs
EPF10K100BFI256-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA,
BGA, BGA256,16X16,40
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Number of I/O Lines
191
191
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
191 I/O
191 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.5 ns
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.7 V
Supply Voltage-Min
2.375 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
256
Moisture Sensitivity Level
3
Number of Inputs
191
Number of Logic Cells
4992
Number of Outputs
191
Package Equivalence Code
BGA256,16X16,40
Peak Reflow Temperature (Cel)
220
Compare EPF10K100EFI256-2N with alternatives
Compare EPF10K100BFI256-3 with alternatives