EPF10K100EBC356-1X
vs
EPF10K100EBC356-1XN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
35 X 35 MM, 1.27 MM PITCH, BGA-356
LBGA,
Pin Count
356
356
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B356
S-PBGA-B356
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
Number of I/O Lines
274
274
Number of Inputs
274
Number of Logic Cells
4992
Number of Outputs
274
Number of Terminals
356
356
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
274 I/O
274 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA356,26X26,50
BGA356,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.4 ns
0.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
1.63 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
35 mm
35 mm
Base Number Matches
2
1
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