EPF10K100EBC356-1 vs EPF10K100EBC356-3 feature comparison

EPF10K100EBC356-1 Altera Corporation

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EPF10K100EBC356-3 Altera Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-356 35 X 35 MM, 1.27 MM PITCH, BGA-356
Pin Count 356 356
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B356 S-PBGA-B356
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 274 274
Number of Inputs 274 274
Number of Logic Cells 4992 4992
Number of Outputs 274 274
Number of Terminals 356 356
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 274 I/O 274 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA356,26X26,50 BGA356,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.4 ns 0.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.63 mm 1.63 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 35 mm 35 mm
Base Number Matches 5 4

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