EPF10K100EBC356-3
vs
EPF10K100EBI356-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
LBGA, BGA356,26X26,50
LBGA, BGA356,26X26,50
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B356
S-PBGA-B356
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
Number of I/O Lines
274
274
Number of Inputs
274
274
Number of Logic Cells
4992
4992
Number of Outputs
274
274
Number of Terminals
356
356
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
274 I/O
274 I/O
Output Function
MIXED
MIXED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA356,26X26,50
BGA356,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
0.7 ns
16 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
1.63 mm
Supply Voltage-Max
2.625 V
2.7 V
Supply Voltage-Min
2.375 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
2
2
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