EPC1064PC
vs
XC1701-PD8I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
XILINX INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Additional Feature
4 WIRE INTERFACE TO FLEX 8000 DEVICES
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.398 mm
9.3599 mm
Memory Density
65536 bit
1048576 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
1048576 words
Number of Words Code
64000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX1
1MX1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.318 mm
4.5974 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
Compare EPC1064PC with alternatives
Compare XC1701-PD8I with alternatives