EP9312-IBZ
vs
XPC8245LZU333LA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CIRRUS LOGIC INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA, BGA352,20X20,50
|
35 X 35 MM, PLASTIC, TBGA-352
|
Pin Count |
352
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Cirrus Logic
|
|
Address Bus Width |
26
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
14.7456 MHz
|
66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
JESD-609 Code |
e1
|
|
Length |
27 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
352
|
352
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA352,20X20,50
|
BGA352,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.5 mm
|
1.65 mm
|
Speed |
184 MHz
|
333 MHz
|
Supply Voltage-Max |
1.94 V
|
2.1 V
|
Supply Voltage-Min |
1.65 V
|
1.9 V
|
Supply Voltage-Nom |
1.8 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
3
|
ECCN Code |
|
3A991.A.2
|
|
|
|
Compare EP9312-IBZ with alternatives
Compare XPC8245LZU333LA with alternatives