EP4SGX70DF29I2X
vs
EP4SGX70DF29I3G
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
,
|
FBGA-780
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
800 MHz
|
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
Length |
29 mm
|
29 mm
|
Number of CLBs |
2904
|
2904
|
Number of Inputs |
372
|
372
|
Number of Logic Cells |
72600
|
72600
|
Number of Outputs |
372
|
372
|
Number of Terminals |
1517
|
780
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2904 CLBS
|
2904 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.3 mm
|
3.5 mm
|
Supply Voltage-Max |
0.93 V
|
0.93 V
|
Supply Voltage-Min |
0.87 V
|
0.87 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
29 mm
|
29 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Intel
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare EP4SGX70DF29I2X with alternatives
Compare EP4SGX70DF29I3G with alternatives