EP4SGX70DF29I3G vs EP4SGX70DF29C3 feature comparison

EP4SGX70DF29I3G Intel Corporation

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EP4SGX70DF29C3 Intel Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-780 29 X 29 MM, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B780 S-PBGA-B780
Length 29 mm 29 mm
Number of CLBs 2904 2904
Number of Inputs 372 372
Number of Logic Cells 72600 72600
Number of Outputs 372 372
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2904 CLBS 2904 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.5 mm 3.3 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 29 mm 29 mm
Base Number Matches 1 2
Rohs Code No
Clock Frequency-Max 717 MHz
JESD-609 Code e0
Qualification Status Not Qualified
Technology CMOS
Terminal Finish TIN LEAD

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