EP4SE530H35I3 vs EP4SE530H35C3NES feature comparison

EP4SE530H35I3 Intel Corporation

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EP4SE530H35C3NES Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-1152 42.50 X 42.50 MM, LEAD FREE, HBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Number of CLBs 212480 21248
Number of Inputs 744
Number of Logic Cells 531200
Number of Outputs 744
Number of Terminals 1152 1152
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 21248 CLBS 21248 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.7 mm 3.7 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 3 1
Temperature Grade OTHER

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