Findchips: Compare EP4CGX50DF27I7N vs EP4CGX50DF27C6N

EP4CGX50DF27I7N vs EP4CGX50DF27C6N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	INTEL CORP	INTEL CORP
Package Description	27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672	27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672
Reach Compliance Code	compliant	compliant
ECCN Code	3A991	3A991
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	Intel	Intel
Clock Frequency-Max	472.5 MHz	472.5 MHz
JESD-30 Code	S-PBGA-B672	S-PBGA-B672
JESD-609 Code	e1	e1
Length	27 mm	27 mm
Moisture Sensitivity Level	3	3
Number of CLBs	49888	3118
Number of Inputs	310	310
Number of Logic Cells	49888	49888
Number of Outputs	310	310
Number of Terminals	672	672
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	3118 CLBS	3118 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA672,26X26,40	BGA672,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.6 mm	2.4 mm
Supply Voltage-Max	1.25 V	1.24 V
Supply Voltage-Min	1.15 V	1.16 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Temperature Grade	INDUSTRIAL	OTHER
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm	27 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays