EP3SL110F780I3N vs EP3SE110F780C3LN feature comparison

EP3SL110F780I3N Intel Corporation

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EP3SE110F780C3LN Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description LEAD FREE, FBGA-780 BGA, BGA780,28X28,40
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e1
Length 29 mm
Moisture Sensitivity Level 3
Number of CLBs 4300
Number of Inputs 488 488
Number of Logic Cells 107500 107500
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4300 CLBS 4300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 29 mm
Base Number Matches 1 1
Clock Frequency-Max 100 MHz
Technology CMOS

Compare EP3SL110F780I3N with alternatives

Compare EP3SE110F780C3LN with alternatives