EP3SL110F780I3N
vs
EP3SE110F780C3LN
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
LEAD FREE, FBGA-780
|
BGA, BGA780,28X28,40
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
|
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
JESD-609 Code |
e1
|
e1
|
Length |
29 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
4300
|
|
Number of Inputs |
488
|
488
|
Number of Logic Cells |
107500
|
107500
|
Number of Outputs |
488
|
488
|
Number of Terminals |
780
|
780
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
4300 CLBS
|
4300 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.2 mm
|
|
Supply Voltage-Max |
0.94 V
|
0.94 V
|
Supply Voltage-Min |
0.86 V
|
0.86 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
29 mm
|
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
100 MHz
|
Technology |
|
CMOS
|
|
|
|
Compare EP3SL110F780I3N with alternatives
Compare EP3SE110F780C3LN with alternatives