EP3SL110F780C2 vs EP3SL110F780I4LN feature comparison

EP3SL110F780C2 Intel Corporation

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EP3SL110F780I4LN Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-780 LEAD FREE, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 800 MHz 717 MHz
JESD-30 Code S-PBGA-B780 S-PBGA-B780
Length 29 mm 29 mm
Number of Inputs 488 488
Number of Logic Cells 107500 107500
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 4300 CLBS 4300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 29 mm 29 mm
Base Number Matches 5 1

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