EP3SE50F484I3 vs EP3SE50F484C3LN feature comparison

EP3SE50F484I3 Altera Corporation

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EP3SE50F484C3LN Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA, BGA484,22X22,40 BGA, BGA484,22X22,40
Pin Count 484
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz 100 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of Inputs 296 296
Number of Logic Cells 47500 47500
Number of Outputs 296 296
Number of Terminals 484 484
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.2 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 23 mm 23 mm
Base Number Matches 2 2
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1900 CLBS

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Compare EP3SE50F484C3LN with alternatives