EP3SE260F1152I4N vs EP3SE260F1152I4 feature comparison

EP3SE260F1152I4N Intel Corporation

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EP3SE260F1152I4 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-1152 FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
Length 35 mm 35 mm
Number of CLBs 10200
Number of Inputs 744 744
Number of Logic Cells 255000 255000
Number of Outputs 744 744
Number of Terminals 1152 1152
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 10200 CLBS 10200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.6 mm 3.9 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 35 mm 35 mm
Base Number Matches 2 2
Clock Frequency-Max 717 MHz
JESD-609 Code e0
Moisture Sensitivity Level 4
Technology CMOS
Terminal Finish TIN LEAD

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Compare EP3SE260F1152I4 with alternatives