EP3SE260F1152I4 vs EP3SE260F1152C3N feature comparison

EP3SE260F1152I4 Intel Corporation

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EP3SE260F1152C3N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description FBGA-1152 BGA, BGA1152,34X34,40
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz 717 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of Inputs 744 744
Number of Logic Cells 255000 255000
Number of Outputs 744 744
Number of Terminals 1152 1152
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 10200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.9 mm 3.9 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 1152
Peak Reflow Temperature (Cel) 245
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

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