EP3SE260F1152I4
vs
EP3SE260F1152C3N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
FBGA-1152
BGA, BGA1152,34X34,40
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max
717 MHz
717 MHz
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of Inputs
744
744
Number of Logic Cells
255000
255000
Number of Outputs
744
744
Number of Terminals
1152
1152
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
10200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.9 mm
3.9 mm
Supply Voltage-Max
0.94 V
0.94 V
Supply Voltage-Min
0.86 V
0.86 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
1152
Peak Reflow Temperature (Cel)
245
Temperature Grade
OTHER
Time@Peak Reflow Temperature-Max (s)
30
Compare EP3SE260F1152I4 with alternatives
Compare EP3SE260F1152C3N with alternatives