EP3SE110F1152C4LN
vs
EP3SE260F1152C3N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
LEAD FREE, FBGA-1152
LEAD FREE, FBGA-1152
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
Intel
Additional Feature
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max
717 MHz
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
Length
35 mm
35 mm
Number of Inputs
744
744
Number of Logic Cells
107500
255000
Number of Outputs
744
744
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4300 CLBS
10200 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.9 mm
3.6 mm
Supply Voltage-Max
0.94 V
0.94 V
Supply Voltage-Min
0.86 V
0.86 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
35 mm
35 mm
Base Number Matches
1
1
JESD-609 Code
e1
Moisture Sensitivity Level
4
Number of CLBs
10200
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Compare EP3SE110F1152C4LN with alternatives
Compare EP3SE260F1152C3N with alternatives