EP3SE260F1152C3N vs EP3SE110F1152C2LN feature comparison

EP3SE260F1152C3N Altera Corporation

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EP3SE110F1152C2LN Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA, BGA1152,34X34,40 BGA, BGA1152,34X34,40
Pin Count 1152
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz 100 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4
Number of Inputs 744 744
Number of Logic Cells 255000 107500
Number of Outputs 744 744
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.9 mm 3.5 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
Base Number Matches 2 2
Organization 4300 CLBS

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