EP3C25F324I7N vs EP3C25F324A7N feature comparison

EP3C25F324I7N Altera Corporation

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EP3C25F324A7N Altera Corporation

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324 LEAD FREE, FBGA-324
Pin Count 324 324
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 472.5 MHz
JESD-30 Code R-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24624 24624
Number of Inputs 215 215
Number of Logic Cells 24624 24624
Number of Outputs 215 215
Number of Terminals 324 324
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24624 CLBS 24624 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 3.5 mm
Supply Voltage-Max 1.25 V 2.625 V
Supply Voltage-Min 1.15 V 2.375 V
Supply Voltage-Nom 1.2 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1

Compare EP3C25F324I7N with alternatives

Compare EP3C25F324A7N with alternatives