EP3C25F324I7N vs EP3C25F324C8 feature comparison

EP3C25F324I7N Intel Corporation

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EP3C25F324C8 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324 19 X 19 MM, 1 MM PITCH, FBGA-324
Reach Compliance Code compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 472.5 MHz 472.5 MHz
JESD-30 Code R-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24624 24624
Number of Inputs 215 215
Number of Logic Cells 24624 24624
Number of Outputs 215 215
Number of Terminals 324 324
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24624 CLBS 24624 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.9 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 324
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20

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