EP2SGX60DF780C5N
vs
EP2SGX60DF780C5
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
|
29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780
|
Pin Count |
780
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Clock Frequency-Max |
640 MHz
|
640 MHz
|
Combinatorial Delay of a CLB-Max |
5.962 ns
|
5.962 ns
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
JESD-609 Code |
e1
|
e0
|
Length |
29 mm
|
29 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
60440
|
60440
|
Number of Inputs |
364
|
364
|
Number of Logic Cells |
60440
|
60440
|
Number of Outputs |
364
|
364
|
Number of Terminals |
780
|
780
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
60440 CLBS
|
60440 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
29 mm
|
29 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare EP2SGX60DF780C5N with alternatives
Compare EP2SGX60DF780C5 with alternatives