EP2SGX60DF780C5N
vs
EP2SGX60CF780C3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780
Pin Count
780
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
640 MHz
717 MHz
Combinatorial Delay of a CLB-Max
5.962 ns
4.45 ns
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e1
e0
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
60440
60440
Number of Inputs
364
364
Number of Logic Cells
60440
60440
Number of Outputs
364
364
Number of Terminals
780
780
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
60440 CLBS
60440 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
29 mm
29 mm
Base Number Matches
2
2
Compare EP2SGX60DF780C5N with alternatives
Compare EP2SGX60CF780C3 with alternatives