EP2C35F672C7N
vs
LFE3-35EA-7FN672C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ALTERA CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LEAD FREE, FBGA-672
Pin Count
672
672
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO REQUIRES 3.3 SUPPLY
Clock Frequency-Max
450 MHz
2932 MHz
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2076
4125
Number of Inputs
475
310
Number of Logic Cells
33216
33000
Number of Outputs
459
310
Number of Terminals
672
672
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
2076 CLBS
4125 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.26 V
Supply Voltage-Min
1.15 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
2
1
ECCN Code
3A991.D
Samacsys Manufacturer
Lattice Semiconductor
Combinatorial Delay of a CLB-Max
0.335 ns
Compare EP2C35F672C7N with alternatives
Compare LFE3-35EA-7FN672C with alternatives