EP2C35F672C7N
vs
LFE3-35EA-6FN672I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
LATTICE SEMICONDUCTOR CORP
|
Package Description |
LEAD FREE, FBGA-672
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Lattice Semiconductor
|
Additional Feature |
ALSO REQUIRES 3.3 SUPPLY
|
|
Clock Frequency-Max |
450 MHz
|
2645 MHz
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e1
|
e1
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2076
|
4125
|
Number of Inputs |
475
|
310
|
Number of Logic Cells |
33216
|
33000
|
Number of Outputs |
459
|
310
|
Number of Terminals |
672
|
672
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
2076 CLBS
|
4125 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA672,26X26,40
|
BGA672,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.25 V
|
1.26 V
|
Supply Voltage-Min |
1.15 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
672
|
ECCN Code |
|
3A991.D
|
Combinatorial Delay of a CLB-Max |
|
0.379 ns
|
Peak Reflow Temperature (Cel) |
|
250
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare EP2C35F672C7N with alternatives
Compare LFE3-35EA-6FN672I with alternatives