EP20K200EFC672-1
vs
EP20K200EFC672
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FINE LINE, BGA-672
|
BGA,
|
Pin Count |
672
|
672
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
160 MHz
|
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e0
|
e1
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Dedicated Inputs |
4
|
4
|
Number of I/O Lines |
376
|
376
|
Number of Inputs |
368
|
|
Number of Logic Cells |
8320
|
|
Number of Outputs |
368
|
|
Number of Terminals |
672
|
672
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
4 DEDICATED INPUTS, 376 I/O
|
4 DEDICATED INPUTS, 376 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA672,26X26,40
|
BGA672,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
220
|
|
Programmable Logic Type |
LOADABLE PLD
|
LOADABLE PLD
|
Propagation Delay |
1.58 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
2.1 mm
|
Supply Voltage-Max |
1.89 V
|
|
Supply Voltage-Min |
1.71 V
|
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare EP20K200EFC672-1 with alternatives
Compare EP20K200EFC672 with alternatives