EP20K100QC240-1
vs
EP20K100EBC356-2N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
FQFP, QFP240,1.3SQ,20
LBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G240
S-PBGA-B356
JESD-609 Code
e0
e1
Length
32 mm
35 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
189
246
Number of Inputs
183
Number of Logic Cells
4160
Number of Outputs
183
Number of Terminals
240
356
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 189 I/O
4 DEDICATED INPUTS, 246 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Equivalence Code
QFP240,1.3SQ,20
BGA356,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
2.5 ns
2.02 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
1.63 mm
Supply Voltage-Max
2.625 V
1.89 V
Supply Voltage-Min
2.375 V
1.71 V
Supply Voltage-Nom
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Width
32 mm
35 mm
Base Number Matches
2
2
ECCN Code
3A991.D
Compare EP20K100QC240-1 with alternatives
Compare EP20K100EBC356-2N with alternatives