EP20K100FI324-3
vs
EP20K100QI240-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
BGA, BGA324(UNSPEC)
FQFP, QFP240,1.3SQ,20
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B324
S-PQFP-G240
JESD-609 Code
e0
e0
Length
19 mm
32 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
246
189
Number of Inputs
246
183
Number of Logic Cells
4160
4160
Number of Outputs
246
183
Number of Terminals
324
240
Organization
4 DEDICATED INPUTS, 246 I/O
4 DEDICATED INPUTS, 189 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Equivalence Code
BGA324(UNSPEC)
QFP240,1.3SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
4.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
19 mm
32 mm
Base Number Matches
2
2
Part Package Code
QFP
Pin Count
240
Peak Reflow Temperature (Cel)
220
Compare EP20K100QI240-3 with alternatives