EP20K100FC324-2X
vs
EP20K100FC324-2N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
FINE LINE, BGA-324
FINE LINE, BGA-324
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e1
Length
19 mm
19 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
252
252
Number of Inputs
246
246
Number of Logic Cells
4160
4160
Number of Outputs
246
246
Number of Terminals
324
324
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 252 I/O
4 DEDICATED INPUTS, 252 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
3 ns
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
324
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare EP20K100FC324-2X with alternatives
Compare EP20K100FC324-2N with alternatives