EP20K100FC324-1V vs EP20K100QC240-1N feature comparison

EP20K100FC324-1V Rochester Electronics LLC

Buy Now Datasheet

EP20K100QC240-1N Intel Corporation

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC INTEL CORP
Part Package Code BGA
Package Description BGA, FQFP,
Pin Count 324
Reach Compliance Code unknown compliant
Clock Frequency-Max 100 MHz
JESD-30 Code S-PBGA-B324 S-PQFP-G240
JESD-609 Code e1 e3
Length 19 mm 32 mm
Number of Dedicated Inputs 4 4
Number of I/O Lines 252 189
Number of Terminals 324 240
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 252 I/O 4 DEDICATED INPUTS, 189 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 2.5 ns 2.5 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 3.5 mm 4.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 19 mm 32 mm
Base Number Matches 2 2
Rohs Code Yes
HTS Code 8542.39.00.01
Moisture Sensitivity Level 3

Compare EP20K100QC240-1N with alternatives