EP20K100QC240-1N vs EP20K100FI324-2 feature comparison

EP20K100QC240-1N Intel Corporation

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EP20K100FI324-2 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FQFP, BGA, BGA324(UNSPEC)
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G240 S-PBGA-B324
JESD-609 Code e3 e0
Length 32 mm 19 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 4 4
Number of I/O Lines 189 246
Number of Terminals 240 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 189 I/O 4 DEDICATED INPUTS, 246 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 2.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 32 mm 19 mm
Base Number Matches 2 2
ECCN Code 3A991.D
Number of Inputs 246
Number of Logic Cells 4160
Number of Outputs 246
Package Equivalence Code BGA324(UNSPEC)

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