EP20K100EBC356-1
vs
EP20K100FC324-2X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
BGA-356
FINE LINE, BGA-324
Pin Count
356
324
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B356
S-PBGA-B324
JESD-609 Code
e0
e0
Length
35 mm
19 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
246
252
Number of Inputs
238
246
Number of Logic Cells
4160
4160
Number of Outputs
238
246
Number of Terminals
356
324
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 246 I/O
4 DEDICATED INPUTS, 252 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA356,26X26,50
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
1.73 ns
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.63 mm
3.5 mm
Supply Voltage-Max
1.89 V
2.625 V
Supply Voltage-Min
1.71 V
2.375 V
Supply Voltage-Nom
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Width
35 mm
19 mm
Base Number Matches
2
2
Compare EP20K100EBC356-1 with alternatives
Compare EP20K100FC324-2X with alternatives