EP1S60F1508I6ES vs EP1S60F1508I6ES feature comparison

EP1S60F1508I6ES Intel Corporation

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EP1S60F1508I6ES Altera Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description BGA, 40 X 40 MM, 1 MM PITCH, FBGA-1508
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1508 S-PBGA-B1508
JESD-609 Code e0 e0
Length 40 mm
Number of Inputs 1022
Number of Outputs 1022
Number of Terminals 1508 1508
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 5712 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Width 40 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 1508

Compare EP1S60F1508I6ES with alternatives

Compare EP1S60F1508I6ES with alternatives