EP1S60F1508I6ES
vs
EP1S60F1508C7
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
40 X 40 MM, 1 MM PITCH, FBGA-1508
40 X 40 MM, 1 MM PITCH, FBGA-1508
Pin Count
1508
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B1508
S-PBGA-B1508
JESD-609 Code
e0
e0
Number of Terminals
1508
1508
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Length
40 mm
Moisture Sensitivity Level
3
Number of CLBs
6570
Number of Inputs
1022
Number of Logic Cells
57120
Number of Outputs
1022
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
5712 CLBS
Package Equivalence Code
BGA1508,39X39,40
Seated Height-Max
3.5 mm
Temperature Grade
COMMERCIAL EXTENDED
Terminal Pitch
1 mm
Width
40 mm
Compare EP1S60F1508I6ES with alternatives
Compare EP1S60F1508C7 with alternatives