EP1S60F1508I6ES vs EP1S60F1508C7 feature comparison

EP1S60F1508I6ES Altera Corporation

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EP1S60F1508C7 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 40 X 40 MM, 1 MM PITCH, FBGA-1508 40 X 40 MM, 1 MM PITCH, FBGA-1508
Pin Count 1508
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1508 S-PBGA-B1508
JESD-609 Code e0 e0
Number of Terminals 1508 1508
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Length 40 mm
Moisture Sensitivity Level 3
Number of CLBs 6570
Number of Inputs 1022
Number of Logic Cells 57120
Number of Outputs 1022
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 5712 CLBS
Package Equivalence Code BGA1508,39X39,40
Seated Height-Max 3.5 mm
Temperature Grade COMMERCIAL EXTENDED
Terminal Pitch 1 mm
Width 40 mm

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