EP1S30F780I5ES vs EP1S30F780C8N feature comparison

EP1S30F780I5ES Altera Corporation

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EP1S30F780C8N Intel Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count 780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e1
Number of Terminals 780 780
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Length 29 mm
Moisture Sensitivity Level 3
Number of CLBs 3819
Number of Inputs 597
Number of Logic Cells 32470
Number of Outputs 597
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 3427 CLBS
Package Equivalence Code BGA780,28X28,40
Seated Height-Max 3.5 mm
Temperature Grade OTHER
Terminal Pitch 1 mm
Width 29 mm

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