EP1S30F780I5ES
vs
EP1S30F780C8N
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
29 X 29 MM, 1 MM PITCH, FBGA-780
Pin Count
780
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e0
e1
Number of Terminals
780
780
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Length
29 mm
Moisture Sensitivity Level
3
Number of CLBs
3819
Number of Inputs
597
Number of Logic Cells
32470
Number of Outputs
597
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
3427 CLBS
Package Equivalence Code
BGA780,28X28,40
Seated Height-Max
3.5 mm
Temperature Grade
OTHER
Terminal Pitch
1 mm
Width
29 mm
Compare EP1S30F780I5ES with alternatives
Compare EP1S30F780C8N with alternatives