EP1S25F672I6ES vs EP1S25F672I7ES feature comparison

EP1S25F672I6ES Intel Corporation

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EP1S25F672I7ES Intel Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-672 BGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e0
Length 27 mm
Number of CLBs 2566
Number of Inputs 473 473
Number of Logic Cells 25660
Number of Outputs 473 473
Number of Terminals 672 672
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2566 CLBS 2566 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm
Base Number Matches 2 2

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