EP1S25F672I7ES
vs
EP1S25F672C6N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
35 X 35 MM, 1.27 MM PITCH, BGA-672
BGA, BGA672,26X26,40
Pin Count
672
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
e1
Number of Terminals
672
672
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Length
27 mm
Moisture Sensitivity Level
3
Number of CLBs
2852
Number of Inputs
473
Number of Logic Cells
25660
Number of Outputs
473
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
2566 CLBS
Package Equivalence Code
BGA672,26X26,40
Seated Height-Max
3.5 mm
Temperature Grade
COMMERCIAL EXTENDED
Terminal Pitch
1 mm
Width
27 mm
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