EP1S20F780I6 vs EP1S20F780I6N feature comparison

EP1S20F780I6 Intel Corporation

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EP1S20F780I6N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 BGA, BGA780,28X28,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2132 2132
Number of Inputs 586 586
Number of Logic Cells 18460 18460
Number of Outputs 586 586
Number of Terminals 780 780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1846 CLBS 2132 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 40

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