EP1S20F780I6
vs
EP1S20F780C6
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e0
e0
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2132
2132
Number of Inputs
586
586
Number of Logic Cells
18460
18460
Number of Outputs
586
586
Number of Terminals
780
780
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1846 CLBS
2132 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
2
2
Pbfree Code
No
Part Package Code
BGA
Pin Count
780
Peak Reflow Temperature (Cel)
220
Temperature Grade
COMMERCIAL EXTENDED
Time@Peak Reflow Temperature-Max (s)
20
Compare EP1S20F780I6 with alternatives
Compare EP1S20F780C6 with alternatives