EP1S10F780C6ES
vs
EP1S10F780I6N
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
BGA,
|
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
JESD-609 Code |
e0
|
e1
|
Number of Inputs |
426
|
426
|
Number of Outputs |
426
|
426
|
Number of Terminals |
780
|
780
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
1057 CLBS
|
1200 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
780
|
Length |
|
29 mm
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
1200
|
Number of Logic Cells |
|
10570
|
Package Equivalence Code |
|
BGA780,28X28,40
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
3.5 mm
|
Terminal Pitch |
|
1 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
29 mm
|
|
|
|
Compare EP1S10F780C6ES with alternatives
Compare EP1S10F780I6N with alternatives