EP1S10F780I6N vs EP1S10F780C5N feature comparison

EP1S10F780I6N Intel Corporation

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EP1S10F780C5N Altera Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 BGA, BGA780,28X28,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1200 1200
Number of Inputs 426 426
Number of Logic Cells 10570 10570
Number of Outputs 426 426
Number of Terminals 780 780
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1057 CLBS 1200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 245
Temperature Grade COMMERCIAL EXTENDED
Time@Peak Reflow Temperature-Max (s) 40

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