EP1K100QI208-2N
vs
EPF10K100EFC256-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
QFP
BGA
Package Description
PLASTIC, QFP-208
17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pin Count
208
256
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
37.5 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e3
e0
Length
28 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Inputs
147
191
Number of Outputs
147
191
Number of Terminals
208
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
147 I/O
191 I/O
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
BGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
245
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
2.1 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
28 mm
17 mm
Base Number Matches
2
2
Number of I/O Lines
191
Number of Logic Cells
4992
Output Function
MIXED
Propagation Delay
0.4 ns
Compare EP1K100QI208-2N with alternatives
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