EP1C12F324C7N
vs
EP1C12F324I7N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
FBGA-324
FBGA-324
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
320 MHz
320 MHz
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e1
Length
19 mm
19 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1206
1206
Number of Inputs
249
249
Number of Logic Cells
12060
12060
Number of Outputs
249
249
Number of Terminals
324
324
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1206 CLBS
1206 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
3.5 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
19 mm
Base Number Matches
1
1
ECCN Code
3A991
Samacsys Manufacturer
Intel
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare EP1C12F324C7N with alternatives
Compare EP1C12F324I7N with alternatives