EN29LV400AB-45RBCP
vs
MX23L6413XI-12G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
EON SILICON SOLUTION INC
MACRONIX INTERNATIONAL CO LTD
Package Description
LFBGA, BGA48,6X8,32
LFBGA, BGA48,6X8,32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
45 ns
120 ns
Alternate Memory Width
8
Boot Block
BOTTOM
Command User Interface
YES
Data Polling
YES
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
9 mm
Memory Density
4194304 bit
67108864 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
1,2,1,7
Number of Terminals
48
48
Number of Words
262144 words
4194304 words
Number of Words Code
256000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.3 mm
1.3 mm
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.000005 A
0.000015 A
Supply Current-Max
0.03 mA
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
6 mm
8 mm
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
48
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare EN29LV400AB-45RBCP with alternatives
Compare MX23L6413XI-12G with alternatives