EFM8BB31F16I-C-QSOP24R
vs
EFM8BB31F16I-C-QFN24
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2019-01-22
|
2019-01-22
|
Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DMA Channels |
YES
|
NO
|
External Data Bus Width |
|
|
JESD-609 Code |
e3
|
e3
|
Length |
8.65 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of I/O Lines |
21
|
20
|
Number of Terminals |
24
|
24
|
PWM Channels |
YES
|
YES
|
Package Code |
SSOP
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Speed |
50 MHz
|
50 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.2 V
|
2.2 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.635 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3.9 mm
|
3 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
CPU Family |
|
8051
|
DAC Channels |
|
YES
|
JESD-30 Code |
|
S-XQCC-N24
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
UNSPECIFIED
|
RAM (bytes) |
|
2304
|
ROM (words) |
|
16384
|
ROM Programmability |
|
FLASH
|
|
|
|
Compare EFM8BB31F16I-C-QSOP24R with alternatives
Compare EFM8BB31F16I-C-QFN24 with alternatives