EFM8BB31F16G-A-QFN32 vs EFM8BB31F16G-C-QFN32 feature comparison

EFM8BB31F16G-A-QFN32 Silicon Laboratories Inc

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EFM8BB31F16G-C-QFN32 Silicon Laboratories Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SILICON LABORATORIES INC SILICON LABORATORIES INC
Package Description , QFN-32
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Technology CMOS CMOS
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
ECCN Code 3A991.A.2
Date Of Intro 2019-01-22
Has ADC YES
Address Bus Width
Bit Size 8
Boundary Scan NO
CPU Family 8051
Clock Frequency-Max 50 MHz
DAC Channels YES
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-XQCC-N32
JESD-609 Code e3
Length 4 mm
Low Power Mode YES
Moisture Sensitivity Level 2
Number of I/O Lines 29
Number of Serial I/Os 2
Number of Terminals 32
Number of Timers 6
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC32,.16SQ,16
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2304
ROM (words) 16384
ROM Programmability FLASH
Seated Height-Max 0.55 mm
Speed 50 MHz
Supply Current-Max 14.4 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 4 mm

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Compare EFM8BB31F16G-C-QFN32 with alternatives