EDI8M32128CA35GB
vs
5962-9318714HXA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ELECTRONIC DESIGNS INC
AEROFLEX MICROELECTRONIC SOLUTIONS
Package Description
,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
CONFIGURABLE AS 128K X 32
Alternate Memory Width
8
JESD-30 Code
S-XHIP-P66
S-XPGA-P66
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
32
Number of Functions
1
Number of Ports
1
Number of Terminals
66
66
Number of Words
262144 words
131072 words
Number of Words Code
256000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256K16
128KX32
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
UNSPECIFIED
CERAMIC
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Base Number Matches
1
3
I/O Type
COMMON
Package Code
PGA
Package Equivalence Code
PGA66,11X11
Screening Level
38535Q/M;38534H;883B
Standby Voltage-Min
2 V
Supply Current-Max
0.6 mA
Terminal Pitch
2.54 mm
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